Features:
— Package: SMT package 0805, colorless diffused resin
— Chip technology: InGaAlP
— Typ. Radiation: 150°
— Color: λdom = 633 nm (● super red)
— Optical efficacy: 7 lm/W
— Corrosion Robustness Class: 3B
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
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